PCB Chat

The hosts of the D-Code podcast are a dynamic trio of young professionals making waves in the electronics manufacturing industry.  With experience rooted in contract manufacturing and stencil fabrication for electronics assemblies, they bring a fresh perspective to the table. Although they’re at the start of their podcasting journey, D-Code has already begun to attract attention, tackling industry insights with a unique lens that up-and-coming voices can uniquely offer.  Mike Konrad's guests are Daniel Stanphill, SMT process engineer at Aurora Boardworks, a contract assembler located in Aurora, Nebraska; Sean Kincaid, president of K & F Electronics, located in Fraser, Michigan, also a contract manufacturer; and Elias Malfavon, president of Metal Etch Services, a SMT stencil fabricator located in San Marcos, California. Mike asks them about their experiences, challenges, and how they’re setting out to decode the world of electronics manufacturing. Chapters: 00:00:00 Introducing the Hosts of Decode Podcast 00:02:37 Key Factors in Choosing a Contract Manufacturer 00:05:53 Evolution of Contract Manufacturers   00:06:20 00:08:03 Evolution of Manufacturing Technology and Job Dynamics 00:10:34 Challenges with Stencil Rigidity  00:13:19 Challenges in Contract Manufacturing for High-Requirement Industries  00:15:57 Advanced Techniques in Moisture Sensitive Electronics 00:18:31 Advantages of Board Fabrication and Design Knowledge in Contract Assembly 00:21:18 Improving PCB Design for Manufacturing Efficiency 00:24:04 Overcoming Manufacturing Challenges with PCB Finishes 00:26:52 Debate on Gloss vs. Matte in PCB Soldering 00:29:31 Advances in SMT Stencil Materials and Technologies 00:32:26 The Challenges of Stencil Printing  00:35:15 The Idea Behind the Podcast  00:37:42 Insights from PCB Manufacturing Experts 00:40:19 Collaborating in Competitive Spaces  00:42:54 Starting a Podcast: Challenges and Solutions 00:45:38 Overcoming Podcast Challenges  00:48:26 The Shift from In-Person Networking to Digital Collaboration 00:51:18 The Evolution of Networking and Conferences  00:54:05 Career Opportunities in Engineering  00:56:37 The Value of IPC Certifications in SMT Production 00:59:37 Influencers in the Electronic Assembly Industry 01:02:12 How to Engage with Reliability Matters Podcast    

On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits. Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount.  From wearable technology and medical devices to aerospace systems and consumer electronics, the use of flexible circuits has expanded rapidly, bringing with it both opportunities and challenges. In this episode, we’ll explore the evolution of flexible circuit technology, discussing its key benefits, such as lightweight construction, enhanced durability, and improved design freedom.  We’ll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance. Mike Konrad's guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics. Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 US patents and numerous foreign ones.  He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi). Some of Joe’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today.  He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach.  In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he’s the guest on my show. 00:00:00 Importance of Flexible Circuits in Modern Electronics   00:02:42 Exploring the World of Flexible Circuits   00:05:30 Introduction to Flexible Circuits: A Historical Perspective 00:08:43 Entrepreneurship Mindset: Naivety and Innovation 00:11:08 The Value of Naivety in Engineering   00:13:43 Innovations in Bubble Printing Technology   00:16:47 Understanding Flex Circuits: Applications and Challenges 00:19:58 The Lifespan and Failure of Torsion Bars   00:22:21 Evolution of Soldier Technology: From Heads-Up Displays to Wearables 00:25:24 The Origins of the Integrated Circuit 00:28:13 Advances in Microelectronics: From Printed Transistors to Modern Tech 00:31:28 Challenges and Solutions in Flexible Circuit Design 00:34:00 Collaborative Design for Efficient Manufacturing   00:36:49 Advances in Flexible HDI and the Upcoming Ultra HDI Conference   00:39:46 Evolution of Flexible Circuits: From 1903 to Present    00:42:40 Innovating Flexible Circuits   00:45:13 Evolution of Toll Road Technology 00:48:08 The Future of Flexible and Stretchable Circuits 00:51:53 Introduction to Verdant Electronics   00:54:46 The Military's Stance on Lead-Free Technology   00:56:27 Innovating Solderless Technology 00:59:18 Insights on Persistence and Success in Entrepreneurship

Today's podcast comes from the Surface Mount Technology Association SMTAI trade show.   As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies. But what exactly are ultra-high-density interconnects? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors.  This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors. In this episode, we’ll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing. To better explain UHDI technology, we’ve put together a panel of subject matter experts. Tara Dunn, director of training and education at SMTA, will moderate a panel discussion with other subject matter experts, including Anaya Vardya, CEO, of American Standard Circuits; Chrys Shea from Shea Engineering Services; Michael Sivigny, owner and general manager of CeTaQ Americas; and Oren Manor, Op-Center core program business director at Siemens Digital Industries Software. UHDI is here! And if you haven’t seen it on your assembly line yet, it’s coming, so stay tuned as we unpack the future of ultra-high-density interconnects and what it means for the next generation of technology.

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.  Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.  In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.  We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry.  And we review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers. Mike Konrad's guest is Mark Waterman. Waterman is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. He began his career at ECD in 2006. Chapters: 00:00:00 Understanding Thermal Profiling in Circuit Assemblies  00:05:19 Evolution of a Manufacturing Business  00:08:00 Understanding Thermal Profiling in Electronics Soldering 00:10:36 Strategies for Circuit Assembly Insulation  00:13:10 Challenges in Sourcing Obsolete Electronic Components 00:15:48 Challenges in Heat Dissipation for 5G and 6G Electronics 00:18:54 Choosing the Right Thermocouple: K Type vs. Others 00:21:35 Challenges with High-Temperature Materials 00:24:04 Determining Thermal Couples for Optimal Measurement 00:26:39 Innovations in Profiling Equipment Technology 00:29:24 Innovations in Display Screens and Risk Mitigation 00:31:55 Cost-Benefit Analysis of Data Loggers  00:34:31 Importance of Calibration Intervals in Industry  00:37:02 The Role of Data Logging in Thermal Profiling 00:39:30 Optimizing Reflow Oven Settings with Predictive Software 00:42:18 Easy Button vs. Detailed Work: Software Development Insights 00:45:20 Common Mistakes in Using Thermal Profilers  00:47:37 Optimizing Thermocouple Measurements in Electronics  00:50:08 Understanding Thermal Barriers and Heat Management 00:52:22 Understanding Thermal Dissipation Challenges 00:54:59 The Importance of Third-Party Auditors in Manufacturing 00:57:32 Insights on Thermal Profiling and Bespoke Solutions 00:59:54 Podcast Contact and Closing Remarks